MFG:. Package Cooled:. D/C:07+
MFG: .
Package Cooled: .
D/C: 07+
Description: The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT ass...
|
Parameter |
Symbol |
Maximum Rating |
Unit |
| Peak Forward Current(1/10 Duty Cycle@1KHz ) |
IFP |
100 |
mA |
| DC Forward Current |
IF |
25 |
mA |
| Power Dissipation |
PD |
68 |
mW |
| Reverse Voltage |
VR |
5 |
V |
| Operating Temperature Range |
TOPR |
-25 to +80 | |
| Storage Temperature Range |
TSTG |
-30 to +85 | |
MSL-174UOL
PDF/DataSheet Download
The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
The MSL-174TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.
The MSL-174SO, a ORANGE source Chip ED device, is designed in an indnstry tandard package suitable for SMT assembly ethod. It utilizes GaAsP on GaP LED chip echnology and water clear epoxy package.
The MSL-174SG, a SIGNAL GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.
The MSL-174HR, a ORANGE source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaAsP on GaP LED chip technology nd water clear epoxy package.
The MSL-174HG, a GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaP on GaP LED chip technology nd water clear epoxy package.
Price: 0.01-100 USD
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