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MFG:.  Package Cooled:.  D/C:07+  

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Part Number: MSL-174UYL

 

MFG: .

Package Cooled: .

D/C: 07+

Description: The MSL-174UYL, a AMBER source Chip LED device, is designed in an indnstry standard package sui...


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MSL-174UYL General Description


The MSL-174UYL, a AMBER  source Chip  LED device, is designed in an indnstry standard   package suitable for SMT assembly method. It  utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

MSL-174UYL Maximum Ratings

Parameter
Symbol
Maximum Rating
Unit
Peak Forward Current(1/10 Duty Cycle@1KHz )
IFP
100
mA
DC Forward Current
IF
25
mA
Power Dissipation
PD
65
mW
Reverse Voltage
VR
5
V
Operating Temperature Range
TOPR
-20 to +80
Storage Temperature Range
TSTG
-30 to +100

MSL-174UYL Features

· Push-Button Backlighting
· LCD Backlighting
· Symbol Backlighting
· Front Panel Indicator

MSL-174UYL Typical Application

· Small Size
· Industry Standard Footprint(0805)
· Compatible with IR Solder process
· Availalble in 8 mm Tape on 7"(178mm) Diameteer Reels

MSL-174UYL datasheet

MSL-174UYL
PDF/DataSheet Download

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MSL-174UYL Relative Products

  • MSL-174UR

    MSL-174UR

    The MSL-174UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.

  • MSL-174UOL

    MSL-174UOL

    The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-174UG

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    The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-174TG

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    The MSL-174TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.

  • MSL-174SO

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    The MSL-174SO, a ORANGE source Chip ED device, is designed in an indnstry tandard package suitable for SMT assembly ethod. It utilizes GaAsP on GaP LED chip echnology and water clear epoxy package.

  • MSL-174SG

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    The MSL-174SG, a SIGNAL GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.

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