MFG:. Package Cooled:. D/C:07+
MFG: .
Package Cooled: .
D/C: 07+
Description: The MSL-194UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT ass...
|
Parameter |
Symbol |
Maximum Rating |
Unit |
| Peak Forward Current(1/10 Duty Cycle@1KHz ) |
IFP |
100 |
mA |
| DC Forward Current |
IF |
25 |
mA |
| Power Dissipation |
PD |
65 |
mW |
| Reverse Voltage |
VR |
5 |
V |
| Operating Temperature Range |
TOPR |
-25 to +80 | |
| Storage Temperature Range |
TSTG |
-30 to +85 | |
MSL-194UOL
PDF/DataSheet Download
The MSL-194UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
The MSL-194TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
The MSL-194SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
The MSL-194SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
The MSL-194HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
The MSL-194HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.
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