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Description: The Micron® 256Mb Mobile SDRAM is a high-speed CMOS, dynamic random-access memory containing 268,4...


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MT48H8M32LF General Description


The Micron® 256Mb Mobile SDRAM is a high-speed CMOS, dynamic random-access memory containing 268,435,456-bits. It is internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x16's 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits. Each of the x32's 67,108,864-bit banks is organized as 4,096 rows by 512 columns by 32 bits.

Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed. The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access.

The SDRAM provides for programmable read or write burst lengths (BLs) of 1, 2, 4, or 8 page locations with a read burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence.

The 256Mb SDRAM uses an internal pipelined architecture to achieve high-speed operation.

It also allows the column address to be changed on every clock cycle to achieve a high-speed, fully random access. Precharging one bank while accessing one of the other three banks will hide the precharge cycles and provide seamless high-speed, randomaccess operation.

MT48H8M32LF Maximum Ratings

Voltage/Temperature Min Max Units
Voltage on VDD/VDDQ supply relative to VSS (1.8V) 0.3 +2.7 V
Voltage on inputs, NC or I/O balls relative to VSS (1.8V) 0.3 +2.7
Storage temperature plastic 55 +150  

MT48H8M32LF Features

• Fully synchronous; all signals registered on positive edge of system clock
• VDD/VDDQ = 1.701.95V
• Internal, pipelined operation; column address can
be changed every clock cycle
• Four internal banks for concurrent operation
• Programmable burst lengths: 1, 2, 4, 8, or continuous page1
• Auto precharge, includes concurrent auto precharge
• Auto refresh and self refresh modes
• LVTTL-compatible inputs and outputs
• On-chip temperature sensor to control refresh rate
• Partial-array self refresh (PASR)
• Deep power-down (DPD)
• Selectable output drive (DS)
• 64ms refresh period (8,192 rows)

MT48H8M32LF datasheet

MT48H8M32LFB5-8ITG
PDF/DataSheet Download

  • Datasheet: MT48H8M32LFB5-8ITG
  • File Size: 1855488 KB
  • Manufacturer: MICRON [Micron Technology]
  • Click here to Download

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