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Part Number: MT4C4M4E9

 

 

 

 

Description: The 4 Meg x 4 DRAM is a randomly accessed, solid-state memory containing 16,777,216 bits organized in ...


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MT4C4M4E9 General Description


The 4 Meg x 4 DRAM is a randomly accessed, solid-state memory containing 16,777,216 bits organized in a x4 configuration. RAS# is used to latch the row address (first 11 bits for 2K and first 12 bits for 4K). Once the page has been opened by RAS#, CAS# is used to latch the column address (the latter 11 bits for 2K and the latter 10 bits for 4K, address pins A10 and A11 are "don't care"). READ and WRITE cycles are selected with the WE# input.

A logic HIGH on WE# dictates READ mode, while a logic LOW on WE# dictates WRITE mode. During a WRITE cycle, data-in (D) is latched by the falling edge of WE# or CAS#, whichever occurs last. An EARLY WRITE occurs when WE# is taken LOW prior to CAS# falling. A LATE WRITE or READ-MODIFY-WRITE occurs when WE# falls after CAS# is taken LOW. During EARLY WRITE cycles, the data outputs (Q) will remain High-Z regardless of the state of OE#. During LATE WRITE or READ-MODIFYWRITE cycles, OE# must be taken HIGH to disable the data outputs prior to applying input data. If a LATE WRITE or READ-MODIFY-WRITE is attempted while keeping OE# LOW, no write will occur, and the data outputs will drive read data from the accessed location.

The four data inputs and the four data outputs are routed through four pins using common I/O, and pin direction is controlled by WE# and OE#.

MT4C4M4E9 Maximum Ratings

Voltage on VCC Pin Relative to VSS:
   3.3V ................................................................ -1V to +4.6V
   5V ...................................................................... -1V to +7V
Voltage on NC, Inputs or I/O Pins Relative to VSS:
   3.3V ................................................................ -1V to +5.5V
   5V ...................................................................... -1V to +7V
Operating Temperature, TA (ambient) ..............0°C to +70°C
Storage Temperature (plastic) .................... -55°C to +150°C
Power Dissipation ............................................................. 1W
Short Circuit Output Current ......................................... 50mA

MT4C4M4E9 Features

• Industry-standard x4 pinout, timing, functions and packages
• State-of-the-art, high-performance, low-power CMOS silicon-gate process
• Single power supply (+3.3V ±0.3V or +5V ±10%)
• All inputs, outputs and clocks are TTL-compatible
• Refresh modes: RAS#-ONLY, HIDDEN and CAS#- BEFORE-RAS# (CBR)
• Optional Self Refresh (S) for low-power data retention
• 11 row, 11 column addresses (2K refresh) or 12 row, 10 column addresses (4K refresh)
• Extended Data-Out (EDO) PAGE MODE access cycle
• 5V-tolerant inputs and I/Os on 3.3V devices

MT4C4M4E9 Connection Diagram

MT4C4M4E9  Connection Diagram

MT4C4M4E9 datasheet

MT4C4M4E9
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