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MFG:MOT/ON  Package Cooled:TO  

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MTD Series Datasheet download

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Part Number: MTD20P06

 

MFG: MOT/ON

Package Cooled: TO

 

 

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MTD20P06 Maximum Ratings


Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
60
Vdc
DraintoGate Voltage (RGS = 1.0 M)
VDGR
60
Vdc
GatetoSource Voltage - Continuous
GatetoSource Voltage - Nonrepetitive (tp 10 ms)
VGS
VGSM
± 15
± 20
Vdc
Vpk
Drain Current - Continuous
- Continuous @ 100°C
- Single Pulse (tp 10 s)
ID
ID
IDM
15
9.0
45
Adc

Apk
Total Power Dissipation @ 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C, when mounted to minimum recommended pad size
PD


72
0.58
1.75
Watts
W/°C
Watts
Operating and Storage Temperature Range
TJ, Tstg
55 to 150
°C
Single Pulse DraintoSource Avalanche Energy - STARTING TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc, PEAK IL =15Apk, L = 2.7mH, RG = 25)
EAS
300
mJ
Thermal Resistance - Junction to Case
- Junction to Ambient
- Junction to Ambient when mounted to minimum recommended pad size
RJC
RJA
RJA
1.73
100
71.4
°C/W

Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds
TL
260
°C
(1) When surface mounted to an FR4 board using the minimum recommended pad size.

Designer's Data for "Worst Case" Conditions - The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves - representing boundaries on device characteristics - are given to facilitate "worst case" design.

Designer's, EFET and HDTMOS are trademarks of Motorola Inc.
TMOS is a registered trademark of Motorola Inc.
Thermal Clad is a trademark of the Bergquist Company.

MTD20P06 Features

• Ultra Low RDS(on), HighCell Density, HDTMOS
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature
• Avalanche Energy Specified
• Surface Mount Package Available in 16 mm, 13inch/2500 Unit, Tape & Reel, Add T4 Suffix to Part Number

MTD20P06 datasheet

MTD20P06
PDF/DataSheet Download

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