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MFG:FAIRC  Package Cooled:TO-252(DPAK)  D/C:09+  

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Part Number: MTD3055VL

 

MFG: FAIRC

Package Cooled: TO-252(DPAK)

D/C: 09+

Description: TMOS V is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. Thi...


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MTD3055VL General Description


TMOS V is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Just as with our TMOS EFET designs, TMOS V is designed to withstand high energy in the avalanche and commutation modes. Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.

MTD3055VL Maximum Ratings


Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
60
Vdc
DraintoGate Voltage (RGS = 1.0 M)
VDGR
60
Vdc
GatetoSource Voltage - Continuous
GatetoSource Voltage - Nonrepetitive (tp 50 ms)
VGS
VGSM
± 15
± 20
Vdc
Vpk
Drain Current - Continuous @ 25°C
- Continuous @ 100°C
- Single Pulse (tp 10 s)
ID
ID
IDM
12
8.0
37
Adc

Apk
Total Power Dissipation @ 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C, when mounted to minimum recommended pad size
PD


48
0.32
1.75
Watts
W/°C
Watts
Operating and Storage Temperature Range
TJ, Tstg
55 to 150
°C
Single Pulse DraintoSource Avalanche Energy - STARTING TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc, PEAK IL =12Apk, L = 1.0mH, RG = 25)
EAS
72
mJ
Thermal Resistance - Junction to Case
- Junction to Ambient
- Junction to Ambient, when mounted to minimum recommended pad size
RJC
RJA
RJA
3.13
100
71.4
°C/W

Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds
TL
260
°C
Designer's Data for "Worst Case" Conditions - The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves - representing boundaries on device characteristics - are given to facilitate "worst case" design.
EFET, Designer's and TMOS V are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.

MTD3055VL Features

• Avalanche Energy Specified
• IDSS and VDS(on) Specified at Elevated Temperature
• Static Parameters are the Same for both TMOS V and TMOS EFET
• Surface Mount Package Available in 16 mm 13inch/2500 Unit Tape & Reel, Add T4 Suffix to Part Number

MTD3055VL datasheet

MTD3055VL
PDF/DataSheet Download

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