MFG:MOTO Package Cooled:TO263
MFG: MOTO
Package Cooled: TO263
Description: The D3PAK package has the capability of housing the largest chip size of any standard, plastic, surface moun...
|
Rating |
Symbol |
Value |
Unit |
| DraintoSource Voltage |
VDSS |
500 |
Vdc |
| DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
500 |
Vdc |
| GatetoSource Voltage - Continuous - NonRepetitive (tp 10 ms) |
VGS VGSM |
± 20 ± 40 |
Vdc Vpk |
| Drain Current - Continuous - Continuous @ 100°C - Single Pulse (tp 10 s) |
ID ID IDM |
20 14.1 60 |
Adc Apk |
| Total Power Dissipation Derate above 25°C Total Power Dissipation @ TC = 25°C (1) |
PD |
250 2.0 3.57 |
Watts W/°C |
| Operating and Storage Temperature Range |
TJ, Tstg |
55 to 150 |
°C |
| Single Pulse DraintoSource Avalanche Energy TJ = 25°C (VDD =100Vdc,VGS = 10Vdc, Vdc,Peak IL =20Apk, L =10mH, RG = 25) |
EAS |
2000 |
mJ |
| Thermal Resistance - Junction to Case - Junction to Ambient - Junction to Ambient (1) |
RJC RJA RJA |
0.5 62.5 35 |
°C/W |
| Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |
MTV20N50E
PDF/DataSheet Download
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