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MFG:ONS Package Cooled:D2PAK D/C:09+

MFG:ONS Package Cooled:D2PAK D/C:09+

| Rating | Symbol | Value | Unit |
| Drain−to−Source Voltage | VDSS | 60 | Vdc |
| Drain−to−Gate Voltage (RGS = 10 M) | VDGR | 60 | Vdc |
| Gate−to−Source Voltage − Continuous − Non−Repetitive (tp10 ms) |
VGS VGS |
±20 ±30 |
Vdc |
| Drain Current − Continuous @ TA = 25 − Continuous @ TA = 100 − Single Pulse (tp10 µs) |
ID ID IDM |
75 50 255 |
Adc Apk |
| Total Power Dissipation @ TA = 25 Derate above 25 Total Power Dissipation @ TA = 25(Note 1) |
PD | 214 1.4 2.4 |
W W/ W |
| Operating and Storage Temperature Range | TJ, Tstg | −55 to +175 |
|
| Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25 (VDD = 75 Vdc, VGS = 10 Vdc, L = 0.3 mH IL(pk) = 55 A, VDS = 60 Vdc) |
EAS | 884 | mJ |
| Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) |
RJC RJA |
0.7 62.5 |
/W |
| Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds |
TL | 260 |
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
NTB75N06
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