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MFG:ON  Package Cooled:D2PAK  D/C:08+  

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Part Number: NTB90N02

 

MFG: ON

Package Cooled: D2PAK

D/C: 08+

Description: Designed for low voltage, high speed switching applications in power supplies, converters and power mo...


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NTB90N02 General Description


Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.

NTB90N02 Maximum Ratings

Rating Symbol Value Unit
Drain−to−Source Voltage VDSS 24 Vdc
Gate−to−Source Voltage
− Continuous		 VGS +20 Vdc
Drain Current
− Continuous @ TA = 25°C
− Single Pulse (tp = 10 s)		 ID
IDM		 90
200		 A
A
Total Power Dissipation @ TA = 25°C
Derate above 25°C		 PD 85
0.66		 W
W/°C
Operating and Storage Temperature TJ, Tstg −55 to +150 °C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 28 Vdc, VGS = 10 Vdc,
L = 5.0 mH, IL(pk) = 17 A, RG = 25 )		 EAS 733 mJ
Thermal Resistance
Junction−to−Case
Junction−to−Ambient (Note 1)		 RJC
RJA		 1.55
70		 °C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8, from case for 10 seconds		 TL 260 °C
1. When surface mounted to an FR4 board using 1, pad size, (Cu Area 1.127 in2).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in2).
*Chip current capability limited by package.

NTB90N02 Features

• Pb−Free Packages are Available

NTB90N02 Typical Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits

NTB90N02 Connection Diagram

NTB90N02 Connection Diagram

NTB90N02 datasheet

NTB90N02
PDF/DataSheet Download

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