NTD18N06L

Transistor Polarity : N-Channel
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Package / Case : DPAK
Packaging : Tube
Continuous Drain Current : 18 A
Gate-Source Breakdown Voltage : +/- 15 V
Drain-Source Breakdown Voltage : 60 V
Resistance Drain-Source RDS (on) : 0.054 Ohms


Features:

• Pb−Free Packages are Available


Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits


Pinout




Specifications

Rating	Symbol	Value	Unit
Drain−to−Source Voltage	VDSS	60	Vdc
Drain−to−Gate Voltage (RGS = 10 M)	VDGR	60	Vdc
Gate−to−Source Voltage − Continuous − Non−repetitive (tp10 ms)	VGS VGS	15 20	Vdc
Drain Current − Continuous @ TA = 25°C − Continuous @ TA = 100°C − Single Pulse (tp10 s)	ID ID IDM	18 10 54	Adc Apk
Total Power Dissipation @ TA = 25°C Derate above 25°C Total Power Dissipation @ TA = 25°C (Note 2)	PD	55 0.36 2.1	W W/°C W
Operating and Storage Temperature Range	TJ, Tstg	−55 to +175	°C
Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 50 Vdc, VGS = 5.0 Vdc, L = 1.0 mH, IL(pk) = 12 A, VDS = 60 Vdc)	EAS	72	mJ
Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) − Junction−to−Ambient (Note 2)	RJC RJA RJA	2.73 100 71.4	°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds	TL	260	°C

Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR−4 board using the minimum recommended
pad size.
2. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.


Description

NTD18N06L Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.