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MFG:ON D/C:06+

MFG:ON D/C:06+

| Rating | Symbol | Value | Unit |
| Drain−to−Source Voltage | VDSS | −20 | V |
| Gate−to−Source Voltage − Continuous | VGS | ±8.0 | V |
| Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (Tp 10 S) |
RJA Pd ID IDM |
244 0.5 −1.65 −10 |
°C/W W A A |
| Thermal Resistance Junction−to−Ambient (Note 2) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (Tp 10 S) |
RJA Pd ID IDM |
128 1.0 −2.35 −14 |
°C/W W A A |
| Thermal Resistance Junction−to−Ambient (Note 3) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (Tp 10 S) |
RJA Pd ID IDM |
62.5 2.0 −3.3 −20 |
°C/W W A A |
| Operating and Storage Temperature Range | TJ, Tstg | −55 to 150 | °C |
| Maximum Lead Temperature for Soldering Purposes for 10 Seconds |
TL | 260 | °C |
NTGS3441T1
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