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D/C:06+

D/C:06+

|
Rating |
Symbol |
Value |
Unit |
|
Drain−to−Source Voltage |
VDSS |
20 |
V |
|
Gate−to−Source Voltage |
VGS |
±12 |
V |
|
Thermal Resistance Junction−to−Ambient (Note 1) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (tp < 10 s) |
R JA P d I D I DM |
244 0.5 2.5 10 |
°C/W W A A |
|
Thermal Resistance Junction−to−Ambient (Note 2) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (tp< 10 s) |
R JA P d I D I DM |
128 1.0 3.6 14 |
°C/W W A A |
|
Thermal Resistance Junction−to−Ambient (Note 3) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C − Pulsed Drain Current (tp < 10 s) |
RJA Pd I D IDM |
62.5 2.0 5.1 20 |
°C/W W A A |
|
Source Current (Body Diode) |
IS |
5.1 |
A |
|
Operating and Storage Temperature Range |
TJ, Tstg |
−55 to 150 |
°C |
|
Maximum Lead Temperature for Soldering Purposes for 10 seconds |
TL |
260 |
°C |
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. Minimum FR−4 or G−10PCB, operating to steady state.
2. Mounted onto a 2" square FR−4 board (1" sq. 2 oz. cu. 0.06" thick single−sided), operating to steady state.
3. Mounted onto a 2" square FR−4 board (1" sq. 2 oz. cu. 0.06" thick single−sided), t < 5.0 seconds.
• Power Management in portable and battery−powered products, i.e. computers, printers, PCMCIA cards, cellular and cordless
• Lithium Ion Battery Applications
• Notebook PC
NTGS3446
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