Features: • Low RDS(on) and Fast Switching Speed in a ChipFET Package• Leadless ChipFET Package 40% Smaller Footprint than TSOP−6• ChipFET Package with Excellent Thermal Capabilities where Heat Transfer is Required• Pb−Free Package is AvailableApplication•...
NTHD4401P: Features: • Low RDS(on) and Fast Switching Speed in a ChipFET Package• Leadless ChipFET Package 40% Smaller Footprint than TSOP−6• ChipFET Package with Excellent Thermal Capa...
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| Rating | Symbol | Value | Unit | ||
| DrainSource Voltage | VDSS | 20 | V | ||
| GateSource Voltage | VGS | ±12 | V | ||
| Continuous Drain Current | Steady State |
TJ = 25 °C | ID | −9.0 | A |
| TJ = 25 °C | −1.5 | ||||
| t 5 s | TJ = 25 °C | −3.0 | |||
| Power Dissipation | Steady State |
TJ = 25 °C | PD | 1.1 | W |
| TJ = 25 °C | 0.6 | ||||
| t 5 s | TJ = 25 °C | 2.1 | |||
| Pulsed Drain Current | tp = 10 s | IDM | −9.0 | A | |
| Operating Junction and Storage Temperature | TJ, TSTG |
−55 to 150 |
°C | ||
| Operating Junction and Storage Temperature | TL | 260 | °C | ||