NTHD4502N Features
• Planar Technology Device Offers Low RDS(on) and Fast Switching Speed
• Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6. Ideal Device for Applications Where Board Space is at a Premium.
• ChipFET Package Exhibits Excellent Thermal Capabilities. Ideal for Applications Where Heat Transfer is Required.
• Pb−Free Package is Available
NTHD4502N Typical Application
• DC−DC Buck or Boost Converters
• Low Side Switching
• Optimized for Battery and Low Side Switching Applications in Computing and Portable Equipment
NTHD4502N Connection Diagram
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