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NTMFS4833N

Features: • Low R DS(on) to Minimize Conduction Losses• Low Capacitance to Minimize Driver Losses• Optimized Gate Charge to Minimize Switching Losses• These are Pb−Free Devices*Application• CPU Power Delivery• DC−DC Converters• Low Side Switchi...

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NTMFS4833N: Features: • Low R DS(on) to Minimize Conduction Losses• Low Capacitance to Minimize Driver Losses• Optimized Gate Charge to Minimize Switching Losses• These are Pb−Free...

NTMFS4833N Data Sheet

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Part Number:
NTMFS4833N
Supply Ability:
5000

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  • 1~5000
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  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Low R DS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These are Pb−Free Devices*


Application

• CPU Power Delivery
• DC−DC Converters
• Low Side Switching


Specifications

Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
30
V
Gate−to−Source Voltage
VGS
±20
V
Continuous Drain
Current RJA
(Note 1)
Steady
State
TA = 25°C
ID
26
A
TA = 85°C
19
Power Dissipation
RJA (Note 1)
TA = 25°C
PD
2.35
W
Continuous Drain
Current RJA
(Note 2)
TA = 25°C
ID
16
A
TA = 85°C
32
Power Dissipation
RJA (Note 2)
TA = 25°C
PD
0.91
W
Continuous Drain
Current RJC
(Note 1)
TC = 25°C
ID
191
A
TC = 85°C
138
Power Dissipation
RJC (Note 1)
TC = 25°C
PD
125
W
Pulsed Drain
Current
TA = 25°C,
tp = 10 s
IDM
288
A
Operating Junction and Storage
Temperature
TJ, TSTG
−55 to
+150
°C
Source Current (Body Diode)
IS
104
A
Drain to Source dV/dt
dV/dt
6
V/ns
Single Pulse Drain−to−Source Avalanche
Energy (TJ = 25°C, VDD = 30 V, VGS = 10 V,
IL = 35 Apk, L = 1.0 mH, RG = 25)
EAS
612.5
mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
TL
260
°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu. 2. Surface−mounted on FR4 board using the minimum recommended pad size.

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.




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