Features: • INTEGRATED ELECTROABSORPTION MODULATOR• INTERNAL DRIVER IC• UP TO 40 km TRANSMISSION 10 Gb/s (Dispersion: 800 ps/nm)• 19-PIN MINI-BUTTERFLY PACKAGESpecifications SYMBOLS PARAMETERS UNITS RATINGS IFLD Forward Current of LD mA 150 VRLD Reverse Vo...
NX8560MC: Features: • INTEGRATED ELECTROABSORPTION MODULATOR• INTERNAL DRIVER IC• UP TO 40 km TRANSMISSION 10 Gb/s (Dispersion: 800 ps/nm)• 19-PIN MINI-BUTTERFLY PACKAGESpecifications ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
| SYMBOLS | PARAMETERS | UNITS | RATINGS |
| IFLD | Forward Current of LD | mA | 150 |
| VRLD | Reverse Voltage of LD | V | 2.0 |
| VSS | Driver Power Supply Voltage | V | -6 to 0 |
| Vm | Modulation Control Voltage of Modulator | V | VSS to VSS +1.2 (0.3 MAX) |
| Vb | Bias Control Voltage of Modulator | V | VSS to VSS + 2.4 (0.3 MAX) |
| Vx1, Vx2 | Cross Point Control Voltage | V | VSS to VSS + 2.4 (0.3 MAX) |
| IFPD | Forward Current of PD | mA | 2 |
| VRPD | Reverse Voltage of PD | V | 15 |
| IC | Cooler Current | A | 1.5 |
| VC | Cooler Voltage | V | 2.5 |
| TC | Operating Case Temperature | 0 to +75 | |
| TSTG | Storage Temperature | -40 to +85 | |
| TSLD | Lead Soldering Temperature (3 sec.) | 30 |