PHT1N60T

Features: SpecificationsDescriptionPHT1N60T N-channel enchancement mode field-effect power transistor in a plastic envelope suitable for surface mounting featuring high avalanche energy capability, stable blocking voltage,fast switching and high thermal cycling performance. Intended for use in com...

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SeekIC No. : 004460708 Detail

PHT1N60T: Features: SpecificationsDescriptionPHT1N60T N-channel enchancement mode field-effect power transistor in a plastic envelope suitable for surface mounting featuring high avalanche energy capability, ...

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Part Number:
PHT1N60T
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/3

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Description



Features:






Specifications






Description

PHT1N60T N-channel enchancement mode field-effect power transistor in a plastic envelope suitable for surface mounting featuring high avalanche energy capability, stable blocking voltage,fast switching and high thermal cycling performance. Intended for use in compact fluroescent lights(CFL)and general purpose switching applications.

There are some limiting values of PHT1N60T(limiting values in accordance with the absolute maximum system).Drain-source voltage(VDS) is 600 V max. Drain-gate voltage(VDGR) is 600 V when RGS is 20 k. Gate-source voltage is 30 V. Drian current(DC)(ID) is 0.65 A when Tsp is 25 or is 0.45 A when Tsp is 100.Drain current(pulse peak value)(IDM) is 2.6 A when Tsp is 25.Source-drain diode current(DC)(IDR) is 0.8 A when Tsp is 25.Source-drain diode current(pulse peak value)(IDRM) is 2.6 A when Tsp is 25.Total power dissipation(Ptot) is 1.8 W when Tsp is 25. Junction temperature(Tj) is 150. Storage temperature(Tstg) is -55 to 150.Otherwise, there are also some thermal resistances about it.Thermal resistance junction to solder point is 15 k/W max. Thermal resistance junction to ambient is 156 K/W typ (pcb mounted;minimum footprint).Static characteristics: Drain-source breakdwon voltage(V(BR)DSS ) is 600 V min when VGS is 0V, ID is 0.25 mA. Gate threshold voltage (VGS(TO) ) is 2.0 Vmin,3.0 V typ and 4.0 V max when VDS is VGS, ID is 0.25 mA. Drin-source leakage current(IDSS) is 1uA typ and 100 uA max when VDS is 500 V , VGS is 0 V, Tj is 25.Gate-source leakage current(IGSS) is 4 nA typ and 100 nA max when VGS is ±35 V,VDS is 0 V.Drain-source on-state resistance(RDS(ON) ) is 8 max when VGS is 10 V , ID is 1 A. Source-drain diode forward voltage(VSD) is 0.85 V typ and 1.2 V max when IF is 2 A, VGS is 0 V.Dynamic characteristics:Forward transconductance(gfs) is 0.5 S min and 0.8 S typ when VDS is 15 V and ID is 1 A. Input capacitance(Ciss) is 75 pF typ and 100 pF max when VGS is 0 V , VDS is 25 V and f is 1 MHz.Feedback capacitance(Crss) is 10 pF typ and 15 pF max when VGS is 0 V , VDS is 25 V and f is 1 MHz.Total gate charge is 5 nC typ when VGS is 10 V , Id is 2 A and VDS is 400 V.Gate to source charge is .5 nC typ when VGS is 10 V , Id is 2 A and VDS is 400 V.Gate to drain(Miller)charge is 3 nC typ when VGS is 10 V , Id is 2 A and VDS is 400 V. Turn-on delay time(tdon) is 5 ns typ and 10 ns max when VDD is 30 V , ID is 2 A , VGS is 10 V , RGS is 50 ohms , RGEN is 50 ohms. Turn-on rise time(tr) is 15 ns typ and 20 ns max when VDD is 30 V , ID is 2 A , VGS is 10 V , RGS is 50 ohms , RGEN is 50 ohms.Turn-off delay time(tdoff) is 15 ns typ and 20 ns max when VDD is 30 V , ID is 2 A , VGS is 10 V , RGS is 50 ohms , RGEN is 50 ohms.

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