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RF3394

Features: • DC to >6000MHz Operation• Internally Matched Input and Output• 20dB Small Signal Gain• +32dBm Output IP3• +18dBm Output Power• Footprint Compatible with Micro-XApplication• Basestation Applications• Broadband, Low-Noise Gain BlocksR...

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SeekIC No. : 004476387 Detail

RF3394: Features: • DC to >6000MHz Operation• Internally Matched Input and Output• 20dB Small Signal Gain• +32dBm Output IP3• +18dBm Output Power• Footprint Compatible...

RF3394 Data Sheet

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Part Number:
RF3394
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/27

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Product Details

Description



Features:

• DC to >6000MHz Operation
• Internally Matched Input and Output
• 20dB Small Signal Gain
• +32dBm Output IP3
• +18dBm Output Power
• Footprint Compatible with Micro-X




Application

• Basestation Applications
• Broadband, Low-Noise Gain Blocks
• IF or RF Buffer Amplifiers
• Driver Stage for Power Amplifiers
• Final PA for Low-Power Applications
• High Reliability Applications




Pinout

Connection Diagram




Specifications

Frequency (MHz) DC to 6000
Gain (dB) 18.7 @ 2000
NF (dB) 3.5
OP1dB (dBm) 17.5
OIP3 (dBm) +32
Vd (V) 4.5
Vcc (V) 6.6
Icc (mA) 65
Package/Size (Dim in mm) QFN, 12pin 3x3


Input RF Power ......................................+13 dBm
Operating Ambient Temperature ...-40 to +85 °C
Storage Temperature.................. -60 to +150 °C




Description

The RF3394 is a general purpose, low-cost RF amplifier IC. The device RF3394 is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process,and has been designed for use as an easily-cascadable 50 gain block. Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 6000MHz.

The device RF3394 is self-contained with 50 input and output impedances and requires only two external DC-biasing elements to operate as specified. The device is designed for cost effective high reliability in a plastic package. The 3mmx3mm footprint is compatible with standard ceramic and plastic Micro-X packages.






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