Features: • 15A, 60V• rDS(ON) = 0.150W• Temperature Compensating PSPICE® Model• Peak Current vs Pulse Width Curve• UIS Rating Curve• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFD15P06, RFD...
RFP15P06: Features: • 15A, 60V• rDS(ON) = 0.150W• Temperature Compensating PSPICE® Model• Peak Current vs Pulse Width Curve• UIS Rating Curve• Related Literature- TB334...
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| RFD15P06, RFD15P06SM, RFP15P06 | UNITS | |
| Drain to Source Voltage (Note 1) VDSS | -60 | V |
| Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | -60 | V |
| Continuous Drain Current ID | 15 | A |
| Pulsed Drain Current (Note 3) IDM | Refer to UIS Curve | A |
| Gate to Source Voltage VGS | ±10 | V |
Power Dissipation PD 25oC |
80 | W |
| Pulsed Avalanche Rating EAS | Figures 6, 16, 17 | |
| Derate above 25oC | 0.533 | A |
| Pulsed Avalanche Rating UIS | Refer to UIS SOA | |
| Operating and Storage Temperature .TJ, TSTG | -55 to 75 | o C |
| Maximum Temperature for Soldering | ||
| Soldering Temperature of Leads for 10s TL | 300 | o C |
| Package Body for 10s, See Techbrief 334 Tpkg | 260 | o C |