Features: • -2A, -80V and -100V• rDS(ON) = 3.500W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC BoardsSpecifications RFP2P08 RFP2P10 UNITS Drain to Source Voltage (Note 1) VDSS -80 -100 V Drain to Gate Voltage (RGS = 20kW) (...
RFP2P08: Features: • -2A, -80V and -100V• rDS(ON) = 3.500W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC BoardsSpecifications RFP2P08 RFP2P10 ...
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RFP2P08 | RFP2P10 | UNITS | |
Drain to Source Voltage (Note 1) VDSS | -80 | -100 | V |
Drain to Gate Voltage (RGS = 20kW) (Note 1) VDGR | -80 | -100 | V |
Continuous Drain Current ID | 2 | 2 | A |
Pulsed Drain Current (Note 3) IDM | 5 | 5 | A |
Gate to Source Voltage VGS | ±20 | ±20 | V |
Maximum Power Dissipation PD | 25 | 25 | W |
Linear Derating Factor | 0.2 | 0.2 | W/o Caaa |
Operating and Storage Temperature .TJ, TSTG | -55 to 150 | -55 to 150 | o C |
Maximum Temperature for Soldering | |||
Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | 300 | o C |
Package Body for 10s, See Techbrief 334 Tpkg | 260 | 260 | o C |