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RFP2P10

Features: • -2A, -80V and -100V• rDS(ON) = 3.500W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC BoardsSpecifications RFP2P08 RFP2P10 UNITS Drain to Source Voltage (Note 1) VDSS -80 -100 V Drain to Gate Voltage (RGS = 20kW) (...

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RFP2P10: Features: • -2A, -80V and -100V• rDS(ON) = 3.500W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC BoardsSpecifications RFP2P08 RFP2P10 ...

RFP2P10 Data Sheet

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Part Number:
RFP2P10
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/27

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Product Details

Description



Features:

• -2A, -80V and -100V
• rDS(ON) = 3.500W
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards


Specifications

  RFP2P08 RFP2P10 UNITS
Drain to Source Voltage (Note 1) VDSS -80 -100 V
Drain to Gate Voltage (RGS = 20kW) (Note 1) VDGR -80 -100 V
Continuous Drain Current ID 2 2 A
Pulsed Drain Current (Note 3) IDM 5 5 A
Gate to Source Voltage VGS ±20 ±20 V
Maximum Power Dissipation PD 25 25 W
Linear Derating Factor 0.2 0.2 W/o Caaa
Operating and Storage Temperature .TJ, TSTG -55 to 150 -55 to 150 o C
Maximum Temperature for Soldering      
Leads at 0.063in (1.6mm) from Case for 10s. TL 300 300 o C
Package Body for 10s, See Techbrief 334 Tpkg 260 260 o C



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