Features: • 4A, 350V and 400V• rDS(ON) = 2.000W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFM7N35 RFM7N40 RFP7N35 RFP7N40 UNITS Drain to Source Voltage (Note 1) VDSS 350 400 350 400 V Drain to G...
RFP4N40: Features: • 4A, 350V and 400V• rDS(ON) = 2.000W• Related Literature- TB334 Guidelines for Soldering Surface Mount Components to PC Boards Specifications RFM7N35 RFM7N40 R...
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| RFM7N35 | RFM7N40 | RFP7N35 | RFP7N40 | UNITS | |
| Drain to Source Voltage (Note 1) VDSS | 350 | 400 | 350 | 400 | V |
| Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 350 | 400 | 350 | 400 | V |
| Continuous Drain Current ID | 4 | 4 | 4 | 4 | A |
| Pulsed Drain Current (Note 3) IDM | 8 | 8 | 8 | 8 | A |
| Gate to Source Voltage VGS | ±20 | ±20 | ±20 | ±20 | V |
| Maximum Power Dissipation PD | 100 | 100 | 100 | 100 | W |
| Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID | 0.6 | 0.6 | 0.6 | 0.6 | W/oC |
| Operating and Storage Temperature .TJ, TSTG | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | oC |
| Maximum Temperature for Soldering | |||||
| Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | 300 | 300 | 300 | o C |
| Package Body for 10s, See Techbrief 334 Tpkg | 260 | 260 | 260 | 260 | o C |