RH27

The RH27 has some dice electrical test limits VS =±15V,VCM = 0V,TA = 25,unless otherwise noted.When symbol is VOS,the parameter is input offset voltage,the max is 150,the unit is V.When symbol is VOUT,the parameter is maximum output voltage range,the conditions is RL2k,the min is ±11.4,the unit is V.When symbol is VOUT,the parameter is maximum output voltage range,the conditions is RL600,the min is ±10.0,the unit is V.When symbol is SR,the parameter is slew rate,the min is 1.7,the unit is V/s.When symbol is PD,the parameter is power dissipation,the max is 170,the unit is mW.

Rad Hard die require special handling as compared to standard IC chips.Rad Hard die are susceptible to surface damage because there is no silicon nitride passivation as on standard die. Silicon nitride protects the die surface from scratches by its hard and dense properties. The passivation on Rad Hard die is silicon dioxide that is much "softer" than silicon nitride.LTC recommends that die handling be performed with extreme care so as to protect the die surface from scratches. If the need arises to move the die around from the chip tray, use a Teflon-tipped vacuum wand.This wand can be made by pushing a small diameter Teflon tubing onto the tip of a steel-tipped wand. The inside diameter of the Teflon tip should match the die size for efficient pickup. The tip of the Teflon should be cut square and flat to ensure good vacuum to die surface.Ensure the Teflon tip remains clean from debris by inspecting under stereoscope.During die attach, care must be exercised to ensure no tweezers touch the top of the die.