Features: · Suitable for short and medium pulse applications up to 1 ms pulse width, 10% duty factor· Diffused emitter ballasting resistors improve ruggedness· Interdigitated emitter-base structure provides high emitter efficiency· Gold metallization with barrier realizes very stable characteristi...
RX1214B130Y: Features: · Suitable for short and medium pulse applications up to 1 ms pulse width, 10% duty factor· Diffused emitter ballasting resistors improve ruggedness· Interdigitated emitter-base structure ...
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· Suitable for short and medium pulse applications up to 1 ms pulse width, 10% duty factor
· Diffused emitter ballasting resistors improve ruggedness
· Interdigitated emitter-base structure provides high emitter efficiency
· Gold metallization with barrier realizes very stable characteristics and excellent lifetime
· Multicell geometry improves power sharing and reduces thermal resistance
· Internal input and output prematching networks allow an easier design of circuits.
In accordance with the Absolute Maximum Rating System (IEC 134).
|
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
| VCBO | collector-base voltage | open emitter | - | 65 | V |
| VCEO | collector-emitter voltage | open base | - | 15 | V |
| VCES | collector-emitter voltage | RBE =0 | - | 60 | V |
| VEBO | emitter-base voltage | open collector | - | 3 | V |
| IC | collector current (DC) | tp 150 s; 5% | - | 9 | A |
| Ptot | total power dissipation | Tmb <75 ; tp 150 s; 5% | - | 280 | W |
| Tstg | storage temperature | -65 | +200 | ||
| Tj | operating junction temperature | - | 200 | ||
| Tsld | soldering temperature | t 10 s; note 1 | - | 235 |
NPN silicon planar epitaxial microwave power transistor in a RX1214B130Y metal ceramic flange package, with base connected to flange.