S71GLxxxNC0

Storage Temperature, Plastic Packages. . . . . . .. 65°C to +150°C
Ambient Temperature with Power Applied. . . . .. 65°C to +125°C
Voltage with Respect to Ground:
V_CC (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . .  . .0.5 V to +4.0 V
V_IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to +4.0 V
A9, OE#, and A_CC (Note 2) . . . . . . . . . . . . . . .. . . 0.5 V to +12.5 V
All other pins (Note 1) . . . . . . . . . . . . . . . . . . ..0.5 V to V_CC + 0.5V
Output Short Circuit Current (Note 3) . . . . . . . . . . . . . . . . . . 200 mA
Notes:
1. Minimum DC voltage on input or I/Os is 0.5 V. During voltage transitions, inputs or I/Os may overshoot VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC voltage on input or I/Os is V_CC + 0.5 V. During voltage transitions, input or I/O pins may overshoot to V_CC + 2.0 V for periods up to 20 ns. See Figure 8.

2. Minimum DC input voltage on pins A9, OE#, and A_CC is 0.5 V. During voltage transitions, A9, OE#, and A_CC may overshoot VSS to 2.0 V for periods of up to 20 ns. See Figure 7. Maximum DC input voltage on pin A9, OE#, and A_CC is +12.5 V which may overshoot to +14.0V for periods up to 20 ns.

3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second.

4. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.

The S71GLxxxNC0 Series is a product line of stacked Multi-chip Product (MCP) packages and consists of
·􀂄 One Flash memory die
·􀂄 One pSRAM
The products covered by this document are listed in the table below. For details about their specifications, please refer to the individual constituent datasheets for further details.