SEP8MA4001

• High efficiency, 50 1m/W with all LEDs illuminated; equivalent to CCFLs
• Low thermal resistance, R_ΘJC = 6°C/W
• High optical output, 25 lm, with all LEDs illuminated
• Superior directivity
• 5.23 mm × 13.7 mm case footprint, and low 2.5-mm overall package height
• Silver-plated leadframe
• LED array of 8 RGB chips

The SEPM series of LEDs provides a range of high-powered ALGaInP red (λ_D = 616 nm), and InGaN green (523 nm) and blue (461 nm) LEDs that can be used in general lighting applications, amusement and gaming equipment, and for backlighting TFT displays. Each module combines 8 LED chips in 4 separate channels.

Modular design allows the SEPM devices to be easily assembled into string arrays by simply connecting the modules in series. The devices also provide superior color balance throughout the display because of the high density of LEDs that can be achieved. This also minimizes the distance that power and control lines must run between LEDs and from the LEDs to the control electronics.

The white thermoplastic case is an innovative Sanken original design with exceptional heat dissipation properties. The white resin compound is especially formulated for superior reflectance and transmittance of the generated light. Enhanced thermal dissipation is achieved through the incorporated heatsink on the bottom of the package. The heatsink can be mated directly to an external radiator through the PCB for superior heat conduction allowing dense placement of modules.

The leadframe is plated with silver, providing a highly-reflective surface for the bottom and sides of the emitting area. The terminals and heatsink are also silver-plated.

Description

The SEPM series of LEDs SEP8MA4001 provides a range of high-powered ALGaInP red (_D = 616 nm), and InGaN green (523 nm) and blue (461 nm) LEDs that can be used in general lighting applications, amusement and gaming equipment, and for backlighting TFT displays. Each module combines 8 LED chips in 4 separate channels.

SEP8MA4001 Modular design allows the SEPM devices to be easily assembled into string arrays by simply connecting the modules in series. The devices also provide superior color balance throughout the display because of the high density of LEDs that can be achieved. This also minimizes the distance that power and control lines must run between LEDs and from the LEDs to the control electronics.

The SEP8MA4001 white thermoplastic case is an innovative Sanken original design with exceptional heat dissipation properties. The white resin compound is especially formulated for superior reflectance and transmittance of the generated light. Enhanced thermal dissipation is achieved through the incorporated heatsink on the bottom of the package. The heatsink can be mated directly to an external radiator through the PCB for superior heat conduction allowing dense placement of modules.

The SEP8MA4001 leadframe is plated with silver, providing a highly-reflective surface for the bottom and sides of the emitting area. The terminals and heatsink are also silver-plated.