Features: ` Avalanche Rugged Technology` Rugged Gate Oxide Technology` Lower Input Capacitance` Improved Gate Charge` Extended Safe Operating Area` Lower Leakage Current : 10 A (Max.) @ VDS = -250V` Lower RDS(ON) : 1.65 (Typ.)Specifications Symbol Characteristic Value Uni...
SFR9224: Features: ` Avalanche Rugged Technology` Rugged Gate Oxide Technology` Lower Input Capacitance` Improved Gate Charge` Extended Safe Operating Area` Lower Leakage Current : 10 A (Max.) @ VDS = -250V`...
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|
Symbol |
Characteristic |
Value |
Units |
|
VDSS |
Drain-to-Source Voltage |
-250 |
V |
|
ID |
Continuous Drain Current (TC=25) |
-2.5 |
A |
| Continuous Drain Current (TC=100) |
-1.5 | ||
|
IDM |
Drain Current-Pulsed |
-10 |
A |
|
VGS |
Gate-to-Source Voltage |
±30 |
V |
|
EAS |
Single Pulsed Avalanche Energy |
156 |
mJ |
|
IAR |
Avalanche Current |
-2.5 |
A |
|
EAR |
Repetitive Avalanche Energy |
3.0 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt |
-4.8 |
V/ns |
|
PD |
Total Power Dissipation (TA=25)* |
2.5
|
W |
| Total Power Dissipation (TC=25) Linear Derating Factor |
30 0.24 |
W W/°C |
|
|
TJ,TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +150 |
°C |
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |