SFRU9310

The features of the SFRU9310 are: (1)avalanche rugged technology; (2)rugged gate oxide technology; (3)lower input capacitance; (4)improved gate charge; (5)extended safe operating area; (6)lower leakage current: -10A(max.)@VDS=-400V; (7)low RDS(ON): 6.000.

The following is about the absolute maximum ratings of SFRU9310: (1)drain-to-source voltage: -400V; (2)continuous drain current(Tc=25): -1.5A; (3)continuous drain current(Tc=100): -0.95A; (4)drain current-pulsed: -5A; (5)gate-to-source voltage: ±30V; (6)single pulse avalanche energy: 115mJ; (7)avalanche current: -1.5A; (8)repetitive avalanche energy: 3.6mJ; (9)peak diode recovery dv/dt: -4.0V/ns; (10)total power dissipation(Tc=25): 2.5W; (11)operating junction and storage temperature range: -55 to +150; (12)maximum lead temp. for soldering purposes: 800.

The electrical characteristics of the SFRU9310 are: (1)drain-source breakdown voltage: -400V min; (2)breakdown voltage temp. coeff.: 0.34V/; (3)gate threshold voltage: -2.0V min and -4.0 max; (4)gate-source leakage, forward: -100nA max; (5)gate-source leakage, reverse: 100nA max; (6)drain-to-source leakage current: -10A max at VGS=-400V; (7)static drain-source in-state resistance: 8.0; (8)forward transonductance: 0.73; (9)input capacitance: 300pF typical and 390pF max; (10)output capacitance: 45pF typical and 55pF max; (11)reverse transfer capacitance: 21pF typical and 25pF max; (12)turn-on delay time: 8ns typical and 25ns max.