SG2012

IN to GND.....................................................................- 0.3V to +6V
Output Short-Circuit Duration............................................Infinite
OUT to GND...................................................- 0.3V to (VIN + 0.3V)
Operating Temperature Range................. ..........- 40°C to +125°C
Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Power Dissipation, PD @ TA = 25
SOT223-3...................................................................................0.74W
Package Thermal Resistance
SOT223-3, JA.......................................................................135°C/W
Lead Temperature (soldering, 10s) ....................................+260°C
ESD Susceptibility
HBM..........................................................................................7000V
MM..............................................................................................400V


Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.