Features: • Mold package-owing to the cross-mold technology,this product can maintain the same performance as the ceramic package.• The chip surface is covered with the highly reliable protection film.• Automatic surface mounting is available.Specifications Parameter Sy...
SGF9: Features: • Mold package-owing to the cross-mold technology,this product can maintain the same performance as the ceramic package.• The chip surface is covered with the highly reliable p...
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|
Parameter |
Symbol |
Unit |
conditions |
Ratings |
|
Peak Reverse Voltage |
Vrm |
V
|
6.0 | |
|
Reverse Voltage |
Vi
|
V |
-5 | |
|
Peak Forward Voltage |
VOUT |
mA |
100 | |
|
Average Eeclifilre Curent |
IO |
mA |
200 | |
|
Storage Temperature Range |
TSTG |
130 | ||
|
Soldering Temperature |
TSTG |
-55 to +150 | ||
|
Mounting Temperatur |
Tdc |
230 |