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SGF Series Datasheet download

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Part Number: SGF9

 

 

 

 

 

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SGF9 Maximum Ratings

Parameter
Symbol
Unit
conditions
Ratings
Peak Reverse Voltage
Vrm
V
6.0
Reverse Voltage
Vi
V
-5
Peak Forward Voltage
VOUT
mA
100
Average Eeclifilre Curent
IO
mA
200
Storage Temperature Range
TSTG
130
Soldering Temperature
TSTG
-55 to +150
Mounting Temperatur
Tdc
230

SGF9 Features

• Mold package-owing to the cross-mold technology,this product can maintain the same performance as the ceramic package.
• The chip surface is covered with the highly reliable protection film.
• Automatic surface mounting is available.

SGF9 datasheet

SGF9
PDF/DataSheet Download

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