SGF9

Features: • Mold package-owing to the cross-mold technology,this product can maintain the same performance as the ceramic package.• The chip surface is covered with the highly reliable protection film.• Automatic surface mounting is available.Specifications Parameter Sy...

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SGF9 Picture
SeekIC No. : 004489364 Detail

SGF9: Features: • Mold package-owing to the cross-mold technology,this product can maintain the same performance as the ceramic package.• The chip surface is covered with the highly reliable p...

floor Price/Ceiling Price

Part Number:
SGF9
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2025/12/25

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Product Details

Description



Features:

• Mold package-owing to the cross-mold technology,this product can maintain the same performance as the ceramic package.
• The chip surface is covered with the highly reliable protection film.
• Automatic surface mounting is available.



Specifications

Parameter
Symbol
Unit
conditions
Ratings
Peak Reverse Voltage
Vrm
V
6.0
Reverse Voltage
Vi
V
-5
Peak Forward Voltage
VOUT
mA
100
Average Eeclifilre Curent
IO
mA
200
Storage Temperature Range
TSTG
130
Soldering Temperature
TSTG
-55 to +150
Mounting Temperatur
Tdc
230



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