Features: • Available in axial leadedpackage • Ultra Fast Recovery Time • High Voltage • Metallurgical bonding • Voidless hermetically sealed glass package • TX, TXV and space level screening available Per Internal Process Specification and SM2337TX, SM2337TXV p...
SM2337: Features: • Available in axial leadedpackage • Ultra Fast Recovery Time • High Voltage • Metallurgical bonding • Voidless hermetically sealed glass package • TX, ...
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| Description | Symbol | Min. | Max. | Unit |
| Minimum Breakdown Voltage | VBR | 1300 | Volts | |
| Working Peak Voltage | Vrwm | 1200 | Volts | |
| Surge Current | IFSM | 60 | Amps | |
| Average Operating Current | IO | 2 | Amps | |
| Thermal Resistance | Rjc | 10 | /W | |
| Thermal Impedance | Zjx | 1.2 | /W | |
| Storage and Junction Temperature Range | Tstg, Tj | -65 to +175 |
High Voltage, Low Leakage, Ultra Fast Rectifier SM2337
IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com