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Part Number: SN54HC367
Description: These hex buffers and line drivers are designedspecifically to improve both the performance anddensity...
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SN54HC367
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DataSheet
General Description
SN54HC367 General Description
These hex buffers and line drivers are designedspecifically to improve both the performance anddensity of 3-state memory address drivers, clock
drivers, and bus-oriented receivers andtransmitters. The 'HC367 devices are organizedas dual 4-line and 2-line buffers/drivers withactive-low output-enable (1OE and 2OE) inputs.When OE is low, the device passes noninverteddata from the A inputs to the Y outputs. When OEis high, the outputs are in the high-impedancestate.
SN54HC367 Maximum Ratings
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . .. . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . .. . . . . . . . . . ±70 mA
Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . 73°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. .. .. .. .. . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. .. .. .. .. .. . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. .. .. .. .. ... . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . .. . . . . . . . . . . . . . −65°C to 150°C
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . .. . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . .. . . . . . . . . . ±70 mA
Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . 73°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. .. .. .. .. . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. .. .. .. .. .. . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . .. .. .. .. .. .. .. .. .. ... . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . .. . . . . . . . . . . . . . −65°C to 150°C
SN54HC367 Features
Wide Operating Voltage Range of 2 V to 6 V
High-Current 3-State Outputs Drive BusLines, Buffer Memory Address Registers,or Drive Up To 15 LSTTL Loads
True Outputs
Low Power Consumption, 80-A Max ICC
Typical tpd = 10 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 A Max
High-Current 3-State Outputs Drive BusLines, Buffer Memory Address Registers,or Drive Up To 15 LSTTL Loads
True Outputs
Low Power Consumption, 80-A Max ICC
Typical tpd = 10 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 A Max
SN54HC367 Connection Diagram
SN54HC367
PDF/DataSheet Download
- Datasheet: SN54HC367
- File Size: 96030 KB
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These hex buffers and line drivers are designedspecifically to improve both the performance anddensity of 3-state memory address drivers, clockdrivers, and bus-oriented receivers andtransmitters. The 'HC365 devices contain sixindependent buffers/drivers with...
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