Features: • Members of the Texas Instruments WidebusTM Family• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA =...
SN74ABT16245: Features: • Members of the Texas Instruments WidebusTM Family• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation• Latch-Up Performance Exceeds 500 ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
• Members of the Texas Instruments WidebusTM Family
• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• High-Drive Outputs (32-mA IOH, 64-mA IOL)
• Packaged in Plastic 300-mil Shrink Small-Outline and Thin Shrink Small-Outline Packages and 380-mil Fine-Pitch Ceramic Flat Packages Using 25-mil Center-to-Center Spacings

The 4ABT16245 is a 16-bit (dual-octal) noninverting 3-state transceiver designed for synchronous two-way communication between data buses. The control function implementation minimizes external timing requirements.
This 4ABT16245 device can be used as two 8-bit transceivers or one 16-bit transceiver. It allows data transmission from the A bus to the B bus or from the B bus to the A bus depending upon the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated.
To ensure the high-impedance state of 4ABT16245 during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.The SN74ABT16245 is available in TI's shrink small-outline package (DL), which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.The SN54ABT16245 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74ABT16245 is characterized for operation from 40°C to 85°C.