Features: • Members of the Texas Instruments WidebusTM Family• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA =...
SN74ABT16540: Features: • Members of the Texas Instruments WidebusTM Family• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation• Latch-Up Performance Exceeds 500 ...
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• Members of the Texas Instruments WidebusTM Family
• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• High-Drive Outputs (32-mA IOH, 64-mA IOL)
• Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

These SN74ABT16540 16-bit buffers and bus drivers provide a high-performance bus interface for wide data paths.
The 3-state control gate of SN74ABT16540 is a 2-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2) input is high, all corresponding outputs are in the high-impedance state.
To ensure the high-impedance state of SN74ABT16540 during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74ABT16540 is available in TI's shrink small-outline package (DL), which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.
The SN54ABT16540 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74ABT16540 is characterized for operation from 40°C to 85°C.