DescriptionThe SN74AC14 is a hex schmitt-trigger inverters.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessar...
SN74AC14: DescriptionThe SN74AC14 is a hex schmitt-trigger inverters.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard...
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The SN74AC14 is a hex schmitt-trigger inverters.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
Features of the SN74AC14 are:(1)EPIC (TM) (enhanced-performance implanted CMOS) submicron process; (2)package options include plastic small-outline (D), shrink small-outline (DB), and thin shrink small-outline (PW)packages, ceramic chip carriers (FK) and Flatpacks (W), and standard plastic (N) and ceramic (J) DIPS.In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
The absolute maximum ratings of the SN74AC14 can be summarized as:(1)output voltage range:-0.5 to Vcc+0.5 V;(2)storage temperature range:-65 to 150;(3)supply voltage range:-0.5 to 7V;(4)input voltage range:-0.5 to Vcc+0.5 V;(5)input clamp current:±20 mA.Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device.These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof.
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