Features: •Available in the Texas Instruments NanoStar ™ and NanoFree ™ Packages• Supports 5-V V CC Operation• Inputs Accept Voltages to 5.5 V• Max t pd of 5 ns at 3.3 V• Low Power Consumption, 10- µ A Max I CC• ± 24-mA Output Drive at 3.3 V...
SN74LVC1T45: Features: •Available in the Texas Instruments NanoStar ™ and NanoFree ™ Packages• Supports 5-V V CC Operation• Inputs Accept Voltages to 5.5 V• Max t pd of 5 ns a...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

This single-bit noninverting bus transceiver SN74LVC1T45 uses two separate configurable power-supply rails. The SN74AVC1T45 is optimized to operate with V CCA /V CCB set at 1.4 V to 3.6 V. It is operational with V CCA /V CCB as low as 1.2 V. The A port is designed to track V CCA . V CCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track V CCB . V CCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
The SN74AVC1T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess I CC and I CCZ .
The SN74LVC1T45 is designed so that the DIR input is powered by V CCA .
This device SN74LVC1T45 is fully specified for partial-power-down applications using I off . The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
The SN74LVC1T45 V CC isolation feature ensures that if either V CC input is at GND, then both ports are in the high-impedance state.
NanoStar ™ and NanoFree ™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.