Features: EPIC (Enhanced-Performance Implanted CMOS) Submicron ProcessTypical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°CTypical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°CPower Off Disables Outputs, Permitting Live InsertionSupports Mixed-Mode Sign...
SN74LVC861A: Features: EPIC (Enhanced-Performance Implanted CMOS) Submicron ProcessTypical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°CTypical VOHV (Output VOH Undershoot) > 2 V at...
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EPIC (Enhanced-Performance Implanted CMOS) Submicron Process
Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot) > 2 V at VCC = 3.3 V, TA = 25°C
Power Off Disables Outputs, Permitting Live Insertion
Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
Latch-Up Performance Exceeds 250 mA Per JESD 17
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages
