HEATPAD TO-220 .009" SP900
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Thermal Interface Products SIL PAD 900 .009" 1.78x1.25x.14x.093
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Thermal Interface Products SIL PAD 900 .009" .750x.500x.187x.125
| Technical/Catalog Information | SP900S-58 |
| Vendor | Bergquist |
| Category | Thermal Management |
| Usage | TO-220 |
| Shape | Rectangular |
| Material | Silicone/Fiberglass |
| Thermal Conductivity | 1.6 W/m-K |
| Thermal Resistivity | 0.6°C/W |
| Thickness | 0.009" (0.23mm) |
| Outline | 19.05mm x 12.70mm |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | SP900S 58 SP900S58 BER176 ND BER176ND BER176 |