SST38VF166

Features: • Single 2.7-3.6V Read and Write Operations• Separate Memory Banks for Code or Data Simultaneous Read and Write Capability• Superior Reliability Endurance: E2 bank - 500,000 Cycles (typical) Flash bank - 100,000 Cycles (typical) Greater than 100 years Data Retention&...

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SST38VF166 Picture
SeekIC No. : 004505303 Detail

SST38VF166: Features: • Single 2.7-3.6V Read and Write Operations• Separate Memory Banks for Code or Data Simultaneous Read and Write Capability• Superior Reliability Endurance: E2 bank - 50...

floor Price/Ceiling Price

Part Number:
SST38VF166
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/24

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Product Details

Description



Features:

• Single 2.7-3.6V Read and Write Operations
• Separate Memory Banks for Code or Data
   Simultaneous Read and Write Capability
• Superior Reliability
   Endurance: E2 bank - 500,000 Cycles (typical) Flash bank - 100,000 Cycles (typical)
   Greater than 100 years Data Retention
• Low Power Consumption
   Active Current, Read: 15 mA (typical)
   Active Current, Concurrent Read while Write: 40 mA (typical)
   Standby Current: 3 µA (typical)
   Auto Low Power Mode Current: 3 µA (typical)
• Fast Write Operation
   Flash Bank-Erase + Program: 8 sec (typical)
   Flash Block-Erase + Program: 500 ms (typical)
   Flash Sector-Erase + Program: 30 ms (typical)
   E2 bank Word-Write: 9 ms (typical)
• Fixed Erase, Program, Write Times
   Remain constant after cycling
• Read Access Time
   70 ns
• Latched Address and Data
• End-of-Write Detection
   Toggle Bit
   Data# Polling
• E2 Bank:
   Word-Write (Auto Erase before Program)
   Sector-Erase (32 Words) + Word-Program (same as Flash bank)
• Flash Bank: Two Small Erase Element Sizes
   1 KWords per Sector or 32 KWords per Block
   Erase either element before Word-Program
• CMOS I/O Compatibility
• JEDEC Standard Command Set
• Packages Available
   48-Pin TSOP (12mm x 20mm)
• Continuous Hardware and Software Data Protection (SDP)
• A One Time Programmable (OTP) E2 Sector



Pinout

  Connection Diagram


Specifications

Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . .  . . . . . . . . -0.5V to VDD + 0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . .. . . . . . . . . . -1.0V to VDD + 1.0V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . .  . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ... . . . . . . . . . . . . . . . . . . 50 mA



Description

The SST38VF166 consists of three memory banks, 2 each 512K x16 bits sector mode flash EEPROM plus a 4K x16 bits word alterable E2PROM manufactured with SST's proprietary, high performance SuperFlash Technology. The SST38VF166 erases and programs with a single power supply. The internal Erase/Program in the E2 bank is transparent to the user. The device conforms to (proposed) JEDEC standard pinouts for word-wide memories.

The SST38VF166 device is divided into three separate memory banks, 2 each 512K x16 Flash banks and a 4K x16 E2 bank. Each Flash bank is typically used for program code storage and contains 512 sectors, each of 1 KWords or 16 blocks, each of 32 KWords. The Flash banks may also be used to store data. The E2 bank is typically used for data or configuration storage and contains 128 sectors, each of 32 words. Any bank may be used for executing code while writing data to a different bank. Each memory bank is controlled by separate Bank Enable (BE#) lines.

The SST38VF166 inherently uses less energy during Erase, Program, and Write than alternative flash technologies. The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter Erase time, the total energy consumed during any Erase, Program, or Write operation is less than alternative flash technologies. The Auto Low Power mode automatically reduces the active read current to approximately the same as standby; thus, providing an average read current of approximately 1 mA/MHz of Read cycle time.

The SuperFlash technology provides fixed Erase, Program, and Write times, independent of the number of Erase/Program cycles that have occurred. Therefore the system software or hardware does not have to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Program times increase with accumulated Erase/Program cycles.




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