Features: • Single 2.7-3.6V Read and Write Operations• Serial Interface Architecture SPI Compatible: Mode 0 and Mode 3• Byte Serial Read with Single Command• Superior Reliability Endurance: 100,000 Cycles (typical) Greater than 100 years Data Retention• Low Power Cons...
SST45VF512: Features: • Single 2.7-3.6V Read and Write Operations• Serial Interface Architecture SPI Compatible: Mode 0 and Mode 3• Byte Serial Read with Single Command• Superior Reliabi...
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• Single 2.7-3.6V Read and Write Operations
• Serial Interface Architecture
SPI Compatible: Mode 0 and Mode 3
• Byte Serial Read with Single Command
• Superior Reliability
Endurance: 100,000 Cycles (typical)
Greater than 100 years Data Retention
• Low Power Consumption:
Active Current: 20 mA (typical)
Standby Current: 10 A (typical)
• Sector or Chip-Erase Capability
Uniform 4 KByte sectors
• Fast Erase and Byte-Program:
Chip-Erase Time: 70 ms (typical)
Sector-Erase Time: 18 ms (typical)
Byte-Program Time: 14 s (typical)
• Automatic Write Timing
Internal VPP Generation
• End-of-Write Detection
Software Status
• 10 MHz Max Clock Frequency
• Hardware Reset Pin (RESET#)
Resets the device to Standby Mode
• CMOS I/O Compatibility
• Hardware Data Protection
Protects and unprotects the device from Write operation
• Packages Available
8-Pin SOIC (4.9mm x 6mm)
Temperature Under Bias .................................................. -55°C to +125°C
Storage Temperature ....................................................... -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential .................. -0.5V to VDD + 0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential .......-1.0V to VDD + 1.0V
Package Power Dissipation Capability (Ta = 25°C) ......................................... 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) .............................. 240°C
Output Short Circuit Current1 ......................................................................... 50 mA