Features: ` TYPICAL RDS(on) = 0.220 ` 100% AVALANCHE TESTED ` VERY LOW INTRINSIC CAPACITANCES ` GATE CHARGE MINIMIZED ` EXTREMELY HIGH dv/dt CAPABILITY ` FOR THROUGH-HOLE VERSION CONTACT SALES OFFICE ` ADD SUFFIX T4 FORORDERING IN TAPE & REELApplication · HIGH CURRENT, HIGH SPEED SWITCHING...
STB16NB25: Features: ` TYPICAL RDS(on) = 0.220 ` 100% AVALANCHE TESTED ` VERY LOW INTRINSIC CAPACITANCES ` GATE CHARGE MINIMIZED ` EXTREMELY HIGH dv/dt CAPABILITY ` FOR THROUGH-HOLE VERSION CONTACT SALES OFF...
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ApplicationHIGH CURRENT, HIGH SWITCHING SPEED MOTOR CONTROL, AUDIO AMPLIFIERS DC-DC & DC-AC CO...
DescriptionThe STB100NF03L-03-01 is the latest development of STMicroelectronis unique Single Fea...
| Symbol | Parameter |
Value |
Unit |
| VDS | Drain-source Voltage (VGS = 0) |
250 |
V |
| VDGR | Drain-gate Voltage (RGS = 20 k) |
250 |
V |
| VGS | Gate- source Voltage |
±30 |
V |
| ID | Drain Current (continuos) at TC = 25 |
16 |
A |
| ID | Drain Current (continuos) at TC = 100 |
10 |
A |
| IDM() | Drain Current (pulsed) |
64 |
A |
| Ptot | Total Dissipation at TC = 25 |
140 |
W |
| Derating Factor |
1.12 |
W/ | |
| dv/dt (1) | Peak Diode Recovery voltage slope |
5.5 |
V/ns |
| Tstg | Storage Temperature |
65 to 150 |
|
| Tj | Max. Operating Junction Temperature |
150 |
Using the latest high voltage MESH OVERLAY™ process of the STB16NB25, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company's proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.