Features: ` TYPICAL RDS(on) = 2.3` EXTREMELY HIGH dv/dt CAPABILITY` 100% AVALANCHE TESTED`VERY LOW INTRINSIC CAPACITANCES`GATE CHARGE MINIMIZEDApplication·HIGH CURRENT, HIGH SPEED SWITCHING·UNINTERRUPTIBLE POWER SUPPLY(UPS)·DC-DC & DC-AC CONVERTERS FOR TELECOM, INDUSTRIAL AND CONSUMER ENVIRONM...
STP5NB90FP: Features: ` TYPICAL RDS(on) = 2.3` EXTREMELY HIGH dv/dt CAPABILITY` 100% AVALANCHE TESTED`VERY LOW INTRINSIC CAPACITANCES`GATE CHARGE MINIMIZEDApplication·HIGH CURRENT, HIGH SPEED SWITCHING·UNINTERR...
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|
Symbol |
Parameter |
Value |
Unit | |
|
STP5NB90 |
STP5NB90FP | |||
|
VDS |
Drain-source Voltage (VGS = 0) |
900 |
V | |
|
VDGR |
Drain- gate Voltage (RGS = 20 k) |
900 |
V | |
|
VGS |
Gate-source Voltage |
± 30 |
V | |
|
ID |
Drain Current (continuous) at Tc = 25 |
5 |
5(*) |
A |
|
ID |
Drain Current (continuous) at Tc = 100 |
3.1 |
3.1(*) |
A |
|
IDM(•) |
Drain Current (pulsed) |
20 |
20 |
A |
|
Ptot |
Total Dissipation at Tc = 25 |
125 |
40 |
W |
| Derating Factor |
1.0 |
0.32 |
W/oC | |
|
dv/dt (1) |
Peak Diode Recovery voltage slope |
4.5 |
4.5 |
V/ns |
|
VISO |
Insulat ion Withstand Voltage (DC) |
- |
2000 |
V |
|
Tstg |
Storage Temperature |
-65 to 150 |
||
|
Tj |
Max. Operating Junction Temperature |
150 |
||
Using the latest high voltage STP5NB90FP MESH OVERLAYTM process, STMicroelectronics has designed an advanced family of power MOSFETs with outstanding performances. The new patent pending strip layout coupled with the Company's proprietary edge termination structure, gives the lowest RDS(on) per area, exceptional avalanche and dv/dt capabilities and unrivalled gate charge and switching characteristics.