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Si5504DC

PinoutSpecifications Parameter Symbol Channel-1 Channel-2 Unit 5 secs Steady State 5 secs Steady State Drain-Source Voltage VDS 30 -30 V Gate-Source Voltage VGS ±20 ±20 Continuous Drain Current (TJ = 150)a TA = 25 ID ±3.9 ±2.9 ±2.8 ±2.1 A TA = 85 ±2.8 ±...

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Si5504DC: PinoutSpecifications Parameter Symbol Channel-1 Channel-2 Unit 5 secs Steady State 5 secs Steady State Drain-Source Voltage VDS 30 -30 V Gate-Source Voltage VGS ±20 ±20...

Si5504DC Data Sheet

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Part Number:
Si5504DC
Supply Ability:
5000

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  • 1~5000
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  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Pinout

Connection Diagram


Specifications

Parameter Symbol Channel-1 Channel-2 Unit
5 secs Steady State 5 secs Steady State
Drain-Source Voltage VDS 30 -30 V
Gate-Source Voltage VGS ±20 ±20
Continuous Drain Current (TJ = 150)a TA = 25 ID ±3.9 ±2.9 ±2.8 ±2.1 A
TA = 85 ±2.8 ±2.1 ±2.0 ±1.5
Continuous Source Current (Diode Conduction)a IS 1.8 0.9 -1.8 -0.9
Pulsed Drain Current IDM ±10 ±10
Maximum Power Dissipationa TA = 25 PD 2.1 1.1 2.1 1.1 W
TA = 85 1.1 0.6 1.1 0.6
Operating Junction and Storage Temperature Range TJ, Tstg -55 to 150
Soldering Recommendations (Peak Temperature)b, c   260

Notes
a. Surface Mounted on 1" x 1" FR4 Board.
b. See Reliability Manual for profile. The ChipFET/PowerPAK is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.




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