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Si5853DC

PinoutSpecifications Parameter Symbol 5 secs Steady State Unit Drain-Source Voltage(MOSFET and Schottky) VDS -20 V Reverse Voltage (Schottky) VKA 20 Gate-Source Voltage(MOSFET) VGS ±8 Continuous Drain Current (TJ = 150) (MOSFET)a TA = 25 ID -3.6 -2.7 A TA = 85...

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Si5853DC: PinoutSpecifications Parameter Symbol 5 secs Steady State Unit Drain-Source Voltage(MOSFET and Schottky) VDS -20 V Reverse Voltage (Schottky) VKA 20 Gate-Source Voltage(MOSF...

Si5853DC Data Sheet

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Part Number:
Si5853DC
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5000

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Product Details

Description



Pinout

Connection Diagram


Specifications

Parameter Symbol 5 secs Steady State Unit
Drain-Source Voltage(MOSFET and Schottky) VDS -20 V
Reverse Voltage (Schottky) VKA 20
Gate-Source Voltage(MOSFET) VGS ±8
Continuous Drain Current (TJ = 150) (MOSFET)a TA = 25 ID -3.6 -2.7 A
TA = 85 -2.6 -1.9
Pulsed Drain Current(MOSFET) IDM -10
Continuous Source Current (MOSFET Diode Conduction)a IS -1.8 -0.9
Average Foward Current (Schottky) IF 1.0 1.0
Pulsed Foward Current (Schottky) IFM 7
Maximum Power Dissipation (MOSFET)a TA = 25 PD 2.1 1.1 W
TA = 85 1.1 0.6
Maximum Power Dissipation (Schottky)a TA = 25 1.3 0.96
TA = 85 0.68 0.59
Soldering Recommendations (Peak Temperature)b, c   260
Operating Junction and Storage Temperature Range TJ, Tstg -55 to 150

Notes
a. Surface Mounted on 1" x1" FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.




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