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Si5856DC

Features: · TrenchFET®Power MOSFETS· Ultra Low rDS(on)· Ultra Low VF Schottky· Si5853DC Pin CompatibleApplication· Buck Rectifier Switch, Buck-Boost· Synchronous Rectifier or Load· Switch For Portable DevicesPinoutSpecifications Parameter Symbol 5 secs Steady State Unit Drain-Sou...

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SeekIC No. : 004490518 Detail

Si5856DC: Features: · TrenchFET®Power MOSFETS· Ultra Low rDS(on)· Ultra Low VF Schottky· Si5853DC Pin CompatibleApplication· Buck Rectifier Switch, Buck-Boost· Synchronous Rectifier or Load· Switch For Po...

Si5856DC Data Sheet

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Part Number:
Si5856DC
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· TrenchFET®Power MOSFETS
· Ultra Low rDS(on)
· Ultra Low VF Schottky
· Si5853DC Pin Compatible




Application

· Buck Rectifier Switch, Buck-Boost
· Synchronous Rectifier or Load
· Switch For Portable Devices




Pinout

Connection Diagram




Specifications

Parameter Symbol 5 secs Steady State Unit
Drain-Source Voltage(MOSFET and Schottky) VDS 20 V
Reverse Voltage (Schottky) VKA 20
Gate-Source Voltage(MOSFET) VGS ±8
Continuous Drain Current (TJ = 150) (MOSFET)a TA = 25 ID 5.9 4.4 A
TA = 85 4.2 3.1
Pulsed Drain Current(MOSFET) IDM 20
Continuous Source Current (MOSFET Diode Conduction)a IS 1.8 0.9
Average Foward Current (Schottky) IF 1.0 1.0
Pulsed Foward Current (Schottky) IFM 7
Maximum Power Dissipation (MOSFET)a TA = 25 PD 2.1 1.1 W
TA = 85 1.1 0.6
Maximum Power Dissipation (Schottky)a TA = 25 1.9 1.1
TA = 85 1.0 0.56
Soldering Recommendations (Peak Temperature)b, c 260
Operating Junction and Storage Temperature Range TJ, Tstg -55 to 150

Notes
a. Surface Mounted on 1" x 1" FR4 Board.
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.






Description

N-Channel 1.8-V (G-S) MOSFET With Schottky Diode Si5856DC




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