Features: ` Ultra-Low On-Resistance Using High Density TrenchFET Gen II Power MOSFET Technology` New Low Thermal Resistance PowerPAK Package with Low 1.07-mm ProfileApplication· Low-Side DC/DC Conversion - Notebook - Server - Workstation· Point-of-Load ConversionSpecifications Parameter Sym...
Si7356DP: Features: ` Ultra-Low On-Resistance Using High Density TrenchFET Gen II Power MOSFET Technology` New Low Thermal Resistance PowerPAK Package with Low 1.07-mm ProfileApplication· Low-Side DC/DC Conv...
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| Parameter | Symbol | 10 secs | Steady State | Unit | |
| Drain-Source Voltage | VDS | 30 | V | ||
| Gate-Source Voltage | VGS | ±20 | |||
| Continuous Drain Current (TJ = 150)a | TA = 25 | ID |
30 |
18 | A |
| TA = 70 | 25 | 15 | |||
| Pulsed Drain Current | IDM | 70 | |||
| Continuous Source Current (Diode Conduction)a | IS | 4.5 | 1.8 | ||
| Maximum Power Dissipationa | TA = 25 | PD | 5.4 | 1.9 | W |
| TA = 70 | 3.4 | 1.2 | |||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 to 150 | /W | ||