Features: ·TrenchFET® Power MOSFET· Ultra-Low rSS(on)· ESD Protected: 4000 V· New MICRO FOOT™ Chipscale Packaging ReducesFootprint Area, Profile (0.65 mm) and On-ResistancePer Footprint AreaApplication· Battery Protection Circuit- 1-2 Cell Li+/LiP Battery Pack for Portable DevicesSpecifi...
Si8902EDB: Features: ·TrenchFET® Power MOSFET· Ultra-Low rSS(on)· ESD Protected: 4000 V· New MICRO FOOT™ Chipscale Packaging ReducesFootprint Area, Profile (0.65 mm) and On-ResistancePer Footprint Ar...
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| Parameter | Symbol | 5secs | Steady State | Unit | |
| Source1-Source2 Voltage | VS1S2 | 20 | V | ||
| Gate-Source Voltage | VGS | ±12 | |||
| Continuous Source1-Source2 Current (TJ = 150)a | TA = 25 | IS1S2 | 5.0 | 3.9 | A |
| TA = 85 | 3.4 | 2.8 | |||
| Pulsed Source1-Source2 Current | ISM | 8 | |||
| Maximum Power Dissipationa | TA = 25 | PD | 1.7 | 1 | W |
| TA = 85 | 0.8 | 0.5 | |||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 to 150 | |||
| Package Reflow Conditionsc | VPR | 215 | |||
| IR/Convection | 220 | ||||