SiHF644N

Features: • Advanced Process Technology• Dynamic dV/dt Rating• 175 Operating Temperature• Fast Switching• Fully Avalanche Rated• Ease of Paralleling• Simple Drive Requirements• Lead (Pb)-free AvailableSpecifications PARAMETER SYMBOL LIM...

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SeekIC No. : 004491149 Detail

SiHF644N: Features: • Advanced Process Technology• Dynamic dV/dt Rating• 175 Operating Temperature• Fast Switching• Fully Avalanche Rated• Ease of Paralleling• Simpl...

floor Price/Ceiling Price

Part Number:
SiHF644N
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/25

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Product Details

Description



Features:

• Advanced Process Technology
• Dynamic dV/dt Rating
• 175 Operating Temperature
• Fast Switching
• Fully Avalanche Rated
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available



Specifications

PARAMETER
SYMBOL
LIMIT
UNIT
Gate - source voltage
VGS
±20
V
Continuous Drain current VGS at 10 V TC = 25
ID
14
A
TC = 100
9.9
Pulsed Drain Currenta,a
IDM
56
Linear Derating Factor
1.0
W/
Single Pulse Avalanche Energy b
EAS
180 e
mJ
Avalanche current
IAR
8.4
A
Repetitive avalanche Energya
EAR
15
mJ
Maximum Power Dissipation TC = 25
PD
150
W
Peak Diode Recovery dV/dtc
dV/dt
7.9
V/ns



Description

Fifth generation Power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.The TO-220 package of D2PAK   is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.

The D2PAK is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on resistance in any existing surface mount package. The D2PAK is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.




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