Features: • Low Gate Charge Qg results in Simple Drive Requirement• Improved Gate, Avalanche and Dynamic dV/dt Ruggedness• Fully Characterized Capacitance and Avalanche Voltage and Current• Effective Coss Specified• Lead (Pb)-free AvailableApplication• Switch Mo...
SiHFBC40AS: Features: • Low Gate Charge Qg results in Simple Drive Requirement• Improved Gate, Avalanche and Dynamic dV/dt Ruggedness• Fully Characterized Capacitance and Avalanche Voltage and...
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|
Parameter |
Symbol |
Limit |
Unit | ||
| Drain-Source Voltage |
VDS |
600 |
V | ||
| Gate-Source Voltage |
VGS |
±30 |
V | ||
| Continuous Drain Currente | VGS at 10 V | TC=25 |
ID |
6.2 |
A |
| TC=70 |
3.9 | ||||
| Pulsed Drain Currenta, e |
IDM |
25 |
A | ||
| Linear Derating Factor |
1.0 |
W/ | |||
| Single Pulse Avalanche Energyb |
EAS |
570 |
mJ | ||
| Repetitive Avalanche Currenta |
IAR |
6.2 |
A | ||
| Repetitive Avalanche Energya |
EAR |
13 |
mJ | ||
| Maximum Power Dissipation | TC=25 |
PD |
125 |
W | |
| Peak Diode Recovery dV/dtc, e |
dV/dt |
6.0 |
V/ns | ||
| Operating Junction and Storage Temperature Range |
TJ, TSTG |
-50 to +150 |
|||
| Soldering Recommendations (Peak Temperature) | for 10 s |
300d | |||